We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Flip chip bonder.
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Flip chip bonder Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Flip chip bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ファインテック日本 Tokyo//Industrial Electrical Equipment
  2. テクノアルファ Tokyo//Electronic Components and Semiconductors
  3. 澁谷工業 メカトロ統轄本部 Ishikawa//Other manufacturing
  4. Ito Corporation Tokyo//Electronic Components and Semiconductors
  5. 5 日精 本社 Tokyo//Machine elements and parts
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Flip chip bonder Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. High-precision die bonder/flip chip bonder 'sigma' ファインテック日本
  2. High-precision multi-die bonder flip chip bonder テクノアルファ
  3. Small-scale production and development die bonder / flip chip bonder DB258 澁谷工業 メカトロ統轄本部
  4. 4 High-precision die bonder and flip chip bonder 'lambda2' ファインテック日本
  5. 5 Multipurpose Die Bonder / Flip Chip Bonder "pico 2" ファインテック日本

Flip chip bonder Product List

1～9 item / All 9 items

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High-precision multi-die bonder flip chip bonder

High-precision multi-die bonder flip chip bonder

Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]

The "FALCON Series" is a die flip chip die bonder that offers a lineup of devices tailored to user needs, ranging from manual to automatic specifications. We can manufacture die flip chip bonders according to your company's required specifications by combining various options. We can propose devices suitable for your specifications, including heating mechanisms, high-load bonding, wafer pickup, and chip flipping functions. Additionally, there are higher models that can accommodate fully automatic specifications with attachments like conveyors, and since these are our own products, we can flexibly respond to your desired customization specifications. 【Features】 ■ Operability Achieves smooth XY stage operability using a joystick. Basic operations can be completed easily with the joystick, providing simple operation specifications. ■ Load Control Supports applications requiring advanced load control through program operation by a motor (Z-axis resolution in micrometers) and VCM control (optional). ■ Software User interface design that does not require a manual. User-friendly specifications that allow for easy setting of bonding parameters and recognition program creation. *For more details, please download the PDF materials.

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  • Bonding Equipment

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Flip Chip Bonder "FB2000SS"

Flip Chip Bonder "FB2000SS"

Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.

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  • Other processing machines

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High-precision die bonder/flip chip bonder 'sigma'

High-precision die bonder/flip chip bonder 'sigma'

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.

  • Bonding Equipment

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High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

Lambda2 is a new standard model of high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact desktop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies, including thermal compression, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact desktop size, it offers a very user-friendly scale for equipment installation, and with future expandability through a modular system, it represents a highly cost-effective model. Lambda2 is a new standard model from Fine Tech, a German manufacturer specializing in die bonders, which has poured its unique know-how into it. The ultra-high precision and usability achieved through its unique design philosophy are unmatched by other manufacturers. For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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Small-scale production and development die bonder / flip chip bonder DB258

Small-scale production and development die bonder / flip chip bonder DB258

The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.

This machine is a high-precision semi-automatic flip chip bonder suitable for experiments, development, and small-scale production. With a digitally adjustable pulse heat stage and various options, it can handle a wide range of assembly processes with just this one unit.

  • Bonding Equipment

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High-precision die bonder / flip chip bonder FDB210 / 211

High-precision die bonder / flip chip bonder FDB210 / 211

It is a high-precision die bonder optimized for mass production of optical devices. Additionally, we also offer the highly precise FDB210P in our lineup.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip and mounting. There are two types: the FDB210 model, which supplies chips and substrates via trays, and the FDB211 model, which supplies with grip rings.

  • Other semiconductor manufacturing equipment

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[In Development] High-Speed FC Bonder CB-2100 (Manufactured by Athlete FA)

[In Development] High-Speed FC Bonder CB-2100 (Manufactured by Athlete FA)

A lineup of features that meet the needs of various factories! Industry-leading speed FCB (Flip Chip Bonder) specialized for small chips.

The "CB-2100" is a high-speed FC bonder that supports a variety of devices (5G/data communication/RFID). It incorporates the elemental technologies cultivated through years of FCB (flip chip bonder) manufacturing and follows the data obtained from structural analysis to accommodate mass production. We offer a lineup including the tabletop model "CB-200," the manual type "CB-505," and the semi-automatic type "CB-600." 【Features】 ■ Compatible with chip trays ■ Automatic cleaning of the head tip ■ Installation of HEPA filters and ionizers ■ Support for various devices (5G/data communication/RFID) ■ Mapping support ■ Production management support *For more details, please refer to the PDF materials or feel free to contact us.

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  • Bonding Equipment

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Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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